Reflow soldering is widely used to manufacture a wide range of electrical components. The tabletop reflow oven forms an integral part of the soldering process, and are also great for DIY component makers. The bench top design of it calls for minimal installation and simple operation for the home or commercial user.
Reflow soldering is commonly used to attach surface mounted components to a circuit board. Less commonly, reflowing can also be used to attach through-hole components to the circuit boards. Solder paste (solder mixed with flux) is used to temporarily attach electrical components to a contact pad. This newly assembled contact pad and attached electrical components are then subject to heating in order to melt the solder, creating a permanent joint. This second step is where the use of this machine comes in.
Reflow ovens must be used so that the areas other than the paste aren't burnt or heated to the point of damage. The four specific features of the oven successfully targets the paste. These consist of preheat, soak, reflow, and cooling stages.
The preheat zone takes the longest time out the four stages. During preheating, the heat increases between 1 to 3 degrees Celsius per second. This rate of increase in heat is called the ramp-up rate. The equipment offer a controlled ramp-up rate so that the component is gradually heated, rather than giving it a heat shock that can cause damage.
The couple minutes after the preheat stage is the thermal soak zone. The oven exposes the combined component to a brief period where the paste is secured and the fluxes are stimulated. There's a restricted range of temperature that is released in order to prevent potential splatter or oxidization. This range not only applies to the maximum heat, but also the minimum limit since the fluxes still need a certain amount of heat to activate.
The third feature of the re-flow oven that offers peak temperatures is the reflow zone. Temperatures during this stage usually range between 20 to 40 degrees Celsius. Meanwhile, the specific temperature relies on the lowest heat tolerance of the component inside.
The temperature will never exceed 60 degrees Celsius in the machine because the parts inside may burn up at that point. The time above liquidus (TAL) comes to play in determining the required length of time of this stage that will properly meld the component together. Incomplete TAL may cause the paste to stay dry instead of melting, thus creating a defective connection.
The re-flow oven finishes the entire molding process in its cooling stage. The melted paste between the components need to cool gradually to create a cohesive unit. If the component isn't cooled with proper measures, the unit might produce intermetallic accumulation or even go into thermal shock. Proper cooling actually requires a faster temperature change rate than heating for it to achieve the best durability. This faster cooling rate usually lies around 4 degrees Celsius per second.
Reflow soldering is commonly used to attach surface mounted components to a circuit board. Less commonly, reflowing can also be used to attach through-hole components to the circuit boards. Solder paste (solder mixed with flux) is used to temporarily attach electrical components to a contact pad. This newly assembled contact pad and attached electrical components are then subject to heating in order to melt the solder, creating a permanent joint. This second step is where the use of this machine comes in.
Reflow ovens must be used so that the areas other than the paste aren't burnt or heated to the point of damage. The four specific features of the oven successfully targets the paste. These consist of preheat, soak, reflow, and cooling stages.
The preheat zone takes the longest time out the four stages. During preheating, the heat increases between 1 to 3 degrees Celsius per second. This rate of increase in heat is called the ramp-up rate. The equipment offer a controlled ramp-up rate so that the component is gradually heated, rather than giving it a heat shock that can cause damage.
The couple minutes after the preheat stage is the thermal soak zone. The oven exposes the combined component to a brief period where the paste is secured and the fluxes are stimulated. There's a restricted range of temperature that is released in order to prevent potential splatter or oxidization. This range not only applies to the maximum heat, but also the minimum limit since the fluxes still need a certain amount of heat to activate.
The third feature of the re-flow oven that offers peak temperatures is the reflow zone. Temperatures during this stage usually range between 20 to 40 degrees Celsius. Meanwhile, the specific temperature relies on the lowest heat tolerance of the component inside.
The temperature will never exceed 60 degrees Celsius in the machine because the parts inside may burn up at that point. The time above liquidus (TAL) comes to play in determining the required length of time of this stage that will properly meld the component together. Incomplete TAL may cause the paste to stay dry instead of melting, thus creating a defective connection.
The re-flow oven finishes the entire molding process in its cooling stage. The melted paste between the components need to cool gradually to create a cohesive unit. If the component isn't cooled with proper measures, the unit might produce intermetallic accumulation or even go into thermal shock. Proper cooling actually requires a faster temperature change rate than heating for it to achieve the best durability. This faster cooling rate usually lies around 4 degrees Celsius per second.
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