The world today is full of electronic devises that help you live an easier life. They come in the form of smart phones, tablets, lap top computers and too many other things to list. The thing most of these items have in common is they all use circuit boards to help maintain continuous service. The reflow soldering oven is one of the machines used to create the circuit boards that are so vital to the communications industry.
Using this machine companies can solder two flat parts together permanently. To do this the machine operator uses powdered solder and places it on the circuits at precise points on a board. When preparations are complete the boards are placed in ovens and heat is applied to melt the solder. This action is permanent and special steps must be taken to insure proper results.
The preheating step is first on the list. This process determines a ramp up rate for the amount of heat that can be applied to the boards in question. When heat is applied too fast it can cause thermal shock to the components or boards. Thermal shock can cause cracking of components or boards and solder paste spattering. Conversely, heating too slow causes the flux in the paste to be incomplete.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The third step in the process is called the reflow zone. It is also referred to as the time above liquidus or TAL and is the point of highest heat in this process. Operators must monitor the temperature closely in this zone because if it surpasses the level of heat that can be tolerated by the weakest component thermal damage will occur. The entire process lasts about a minute and the solder becomes liquid and "reflows".
The cooling zone is the final part of the process. The boards are allowed to cool slowly while the solder becomes a solid again. This procedure is not monitored as closely as the others and many consider it to be less critical that the first three steps. Experts disagree with this concept and advise that the boards be cooled in controlled conditions that help to deter thermal shock to boards and components alike.
Having a window to watch the entire process is one of the ways the manufacturer helps the operator. Most of the machines are computerized and can be pre-programmed to do the work without human assistance but being able to see what is happening is important especially on a new run. Many have USB connections so the operators can view them on their computers.
These ovens make it possible for you to enjoy the technical electrical gadgets that make life easier. As the technology advances they will become more streamlined and advanced to keep pace.
Using this machine companies can solder two flat parts together permanently. To do this the machine operator uses powdered solder and places it on the circuits at precise points on a board. When preparations are complete the boards are placed in ovens and heat is applied to melt the solder. This action is permanent and special steps must be taken to insure proper results.
The preheating step is first on the list. This process determines a ramp up rate for the amount of heat that can be applied to the boards in question. When heat is applied too fast it can cause thermal shock to the components or boards. Thermal shock can cause cracking of components or boards and solder paste spattering. Conversely, heating too slow causes the flux in the paste to be incomplete.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The third step in the process is called the reflow zone. It is also referred to as the time above liquidus or TAL and is the point of highest heat in this process. Operators must monitor the temperature closely in this zone because if it surpasses the level of heat that can be tolerated by the weakest component thermal damage will occur. The entire process lasts about a minute and the solder becomes liquid and "reflows".
The cooling zone is the final part of the process. The boards are allowed to cool slowly while the solder becomes a solid again. This procedure is not monitored as closely as the others and many consider it to be less critical that the first three steps. Experts disagree with this concept and advise that the boards be cooled in controlled conditions that help to deter thermal shock to boards and components alike.
Having a window to watch the entire process is one of the ways the manufacturer helps the operator. Most of the machines are computerized and can be pre-programmed to do the work without human assistance but being able to see what is happening is important especially on a new run. Many have USB connections so the operators can view them on their computers.
These ovens make it possible for you to enjoy the technical electrical gadgets that make life easier. As the technology advances they will become more streamlined and advanced to keep pace.
About the Author:
You can visit www.sikama.com for more helpful information about Looking At The Reflow Soldering Oven.
No comments:
Post a Comment